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RP124

Wafer ring to wafer ring replacing machine with vision inspection for WLCSP, KGD(Known Good Die), and WLCSP-LED

Integrated test for WLCSP, KGD Optical test for WLCSP- LED 6-side vision available(IR vision as option)

Advantages
  • Integrated test for WLCSP, KGD
  • Optical test for WLCSP-LED available
  • 6-side vision inspection(IR vision as option)
UPH 24,000UPH (cycle time 150ms)
Input Wafer (6, 8 inch)
Output Wafer (6, 8 inch)
Target devices
  • WLCSP
  • KGD
  • Bare dies
  • WLCSP-LED
Device size Min.0.4 x 0.2mm to Max.7 x 7mm

We will offer the best for you.
Feel free to contact us.

Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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Phone +81-93-202-4353

( 9:00 AM to 5:00 PM )