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RS20

High speed pick-up handler for a 12, 8, 6 inch wafer with integrated vision, test, and laser marking

Highest UPH 50,000 Flexible configuration 6-side vision, integrated testing, laser marking, and re-testing

Advantages
  • Highest UPH 50,000
  • Damage free pick up and handling (patented)
  • Small WLCSP, bare dies(Min. 0.4 x 0.2mm) handling
  • Micro-crack 6-side vision inspection (IR vision as option)
  • Flip or non-flip (option)
UPH 50,000UPH (cycle time 72ms)
Input Wafer (6, 8, 12 inch), de-taping as option
Output Tape & Reel (4, 8, 12, 16mmW)
Target devices
  • WLCSP
  • Bare dies
  • Power dies
  • Discrete
  • FOWLP
  • Passives
Device size Min. 0.4 x 0.2mm (thinner devices less than t0.1mm) to Max. 7 x 7mm

We will offer the best for you.
Feel free to contact us.

Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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Phone +81-93-202-4340

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