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RV320

Wafer to Tape & Reel for non-flip WLCSP and WLCSP-LED with integrated testing

Integrated test for WLCSP Optical test for WLCSP-LED 6-side vision inspection(IR vision as option)

Advantages	Wafer to Tape & Reel for non-flip devices Integrated test for WLCSP Optical test for WLCSP-LED available 6-side vision(IR vision as option)
UPH	24,000UPH (cycle time 150ms)
Input	Wafer (6, 8 inch)
Output	Tape & Reel (4, 8, 12, 16mmW)
Target devices	WLCSP KGD Bare dies WLCSP-LED
Device size	Min.0.4 x 0.2mm to Max.7 x 7mm
Related keywords	5S 8 inch AI AOI ARC module Assembly equipment CK color camera Conversion kit Crack CSP Deep learning Handler IR micron multi bin non contact alignment PNP Reconstruction Room temperature RW Scratch Semiconductor Sensor tape&reel TOF UPH VCSEL Vision inspection machine W2W Wafer wafer reconstruction WLCSP

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Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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RP124

Wafer ring to wafer ring replacing machine with vision inspection for WLCSP, KGD(Known Good Die), and WLCSP-LED

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Phone +81-93-202-4353

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