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RV-evo

High speed die sorter with vision inspection for WLCSP, bare-dies, discrete, and passive devices

High speed 50KUPH pick up die sorter for small devices on an 8, 6 inch wafer. Suitable for low mix and high volume mass production. 6-side vision available.

Advantages
  • High speed & damage free handling (patented)
  • 50KUPH
  • Small WLCSP, bare dies(Min. 0.4 x 0.2mm) handling
  • Micro-crack 6-side vision inspection
UPH 50,000UPH (cycle time72ms)
Input Wafer (6, 8 inch)
Output Tape & Reel(4, 8, 12, 16mmW)
Target devices
  • WLCSP
  • Bare dies
  • Discrete
  • Passives
Device size Min. 0.4 x 0.2mm (thinner devices less than t0.1mm) to Max. 3 x 3 mm

We will offer the best for you.
Feel free to contact us.

Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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