Products inquiry form
General inquiry form

TR-Wafer

High speed wafer to tray machine with vision inspection No time loss of tray change

Wide target device range from small to big Flexible tray size (JEDEC and waffle trays) Re-construction mode(tray to wafer) available as option

Advantages
  • Wide target device range small to big
  • 6-side micro crack vision(IR vision as option)
  • No UPH loss of tray change
  • Re-construction mode(tray to wafer) as option
UPH 36,000UPH (cycle time 100ms)
Input Wafer (8, 12 inch)
Output Tray (JEDEC、waffle, stack or magazine loading)
Target devices
  • QFN
  • BGA
  • WLCSP
  • FOWLP
  • Bare die
  • Power device
  • Module
  • Sensor
Device size Min.1 x 1mm to Mx.15 x 15mm

We will offer the best for you.
Feel free to contact us.

Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

Related products

Contact us (about products)

Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

Contact us (general)

Phone +81-93-202-4353

( 9:00 AM to 5:00 PM )