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TS-evo

Easy changeover Flexible pick up die sorter and handler

Wide target device range from ultra small to big devices Easy changeover of wafer size, device size, and tape & reel width. 6-side vision available(IR vision as option)

Advantages
  • Easy changeover in short time
  • Ultra small devices(0.4 x 0.2mm) to big devices(12 x 12mm)
  • 6-side micro crack vision inspection(IR vision as option)
  • Integrated test available
  • Flip or non-flip (option)
UPH 50,000UPH (cycle time 720ms)
Input Wafer (8, 12 inch), de-taping as option
Output Tape & Reel (4, 8, 12, 16, 24mmW easy changeover)
Target devices
  • WLCSP
  • Bare dies
  • Power dies
  • Discrete
  • FOWLP
  • Passives
Device size Min. 0.4 x 0.2mm (thinner devices less than t0.1mm) to Max. 12 x 12 mm

We will offer the best for you.
Feel free to contact us.

Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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Contact us (about products)

Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

Contact us (general)

Phone +81-93-202-4353

( 9:00 AM to 5:00 PM )