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WS-evo

12” wafer ring to 12” wafer ring high speed reconstruction machine with vision inspection for WLCSP, KGD(Known Good Die), and image sensor on a 12” wafer.

30,000UPH high productivity. 6S-vision inspection(IR option). Cleanroom class 100 compliant.

Advantages
  • High speed wafer reconstruction for WLCSP, bare-die, and image sensor
  • 6-side vision inspection(IR option)
  • Class 100 compliant in a cleanroom
UPH 30,000UPH (cycle time 120ms)
Input Wafer (12, 8 inch)
Output Wafer (12, 8 inch)
Target devices
  • WLCSP
  • KGD
  • Bare die
  • Image sensor
Device size Min.0.4 x 0.2mm to Max.15 x 15mm

We will offer the best for you.
Feel free to contact us.

Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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Phone +81-93-202-4353

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