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Pick-up handler for a 12, 8, 6 inch wafer integrated vision, test, and laser marking

Flexible configuration 6-side vision, integrated testing, laser marking, and re-testing

Advantages	Damage free pick up and handling (patented) Small WLCSP, bare dies(Min. 0.4 x 0.2mm) handling Micro-crack 6-side vision inspection (IR vision as option) 2-side(top & bottom) clamping test
UPH	30,000UPH (cycle time 120ms)
Input	Wafer (6, 8, 12 inch), de-taping as option
Output	Tape & Reel (4, 8, 12, 16mmW)
Target devices	WLCSP Bare dies Power dies Discrete FOWLP Passives
Device size	Min. 0.4 x 0.2mm (thinner devices less than t0.1mm) to Max. 7 x 7 mm
Related keywords	12 inch 5S 8 inch AI AOI ARC module Assembly equipment BAW BGA carrier tape CK color camera Conversion kit Crack CSP Deep learning detaper detaping DFN Discrete EMI coating flip Handler High temperature hole device hole IC IC IR KGD laser Laser marking LiDar LSI MEMS micron Mold multi bin non contact alignment OS packer passive components PD picker PNP Power device QFN R2R Room temperature SAW Scratch Semiconductor Sensor tape&reel taper Taping Test Handler Tester TNR TOF UPH VCSEL Vision inspection machine W2tape Wafer waffle pack WLCSP

We will offer the best for you.
Feel free to contact us.

Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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Phone +81-93-202-4340

( 9:00 AM to 5:00 PM )

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General inquiry form

Phone +81-93-202-4353

( 9:00 AM to 5:00 PM )